Si1071X
Vishay Siliconix
SPECIFICATIONS (T J = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
V DS Temperature Coefficient
V GS(th) Temperature Coefficient
V DS
? V DS /T J
? V GS(th) /T J
V GS = 0 V, I D = - 250 μA
I D = - 250 μA
- 30
- 32.07
3.02
V
mV/°C
Gate-Source Threshold Voltage
V GS(th)
V DS = V GS , I D = - 250 μA
- 0.7
- 1.45
V
On-State Drain Current
Gate-Source Leakage
Zero Gate Voltage Drain Current
a
I GSS
I DSS
I D(on)
V DS = 0 V, V GS = ± 12 V
V DS = - 30 V, V GS = 0 V
V DS = - 30 V, V GS = 0 V, T J = 85 °C
V DS = ? 5 V, V GS = - 10 V
V GS = - 10 V, I D = - 0.96 A
-8
0.139
± 100
-1
- 10
0.167
nA
nA
μA
A
Drain-Source On-State Resistance a
R DS(on)
V GS = - 4.5 V, I D = - 0.9 A
0.147
0.177
?
V GS = - 2.5 V, I D = - 0.79 A
0.195
0.244
Forward Transconductance
g fs
V DS = - 15 V, I D = - 0.96 A
4.25
S
Dynamic
b
Input Capacitance
C iss
315
Output Capacitance
Reverse Transfer Capacitance
C oss
C rss
V DS = - 15 V, V GS = 0 V, f = 1 MHz
60
45
pF
Total Gate Charge
Gate-Source Charge
Q g
Q gs
V DS = - 15 V, V GS = - 4.5 V, I D = - 0.96 A
V DS = - 15 V, V GS = - 10 V, I D = - 0.96 A
4.43
8.87
0.83
6.64
13.3
nC
Gate-Drain Charge
Q gd
1.57
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
R g
t d(on)
t r
t d(off)
t f
t d(on)
t r
t d(off)
t f
f = 1 MHz
V DD = - 15 V, R L = 19.74 ?
I D ? - 0.76 A, V GEN = - 10 V, R g = 1 ?
V DD = - 15 V, R L = 20.27 ?
I D ? - 0.74 A, V GEN = - 4.5 V, R g = 1 ?
9.8
3.8
12
18
7
13
25
36
14
14.7
5.7
18
27
10.5
20
38
54
21
?
ns
Drain-Source Body Diode Characteristics
Pulse Diode Forward Current a
I SM
8
A
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery
Reverse Recovery Fall Time
V SD
t rr
Q rr
t a
I S = - 0.63 A
I F = - 0.7 A, dI/dt = 100 A/μs
0.8
12.7
5.7
8.9
1.2
19.05
8.6
V
nC
ns
Reverse Recovery Rise Time
t b
3.8
Notes:
a. Pulse test; pulse width ? 300 μs, duty cycle ? 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 74321
S10-2542-Rev. C, 08-Nov-10
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